I’m designing a simple H-bridge for simple but large projects. These are 300A 40V MOSFETS. The board also has a driver for the MOSFETs. I hope to find a driver that uses I2C or some other interface, rather than PWM.
The board overall is pretty small, but I haven’t figured out a good way to heat sink it. The unpopulated round footprints are for capacitors, and when the caps are installed, they block any easy installation of a heat sink over the MOSFETs. I may design the second iteration of the board around thermal management, and have holes for mounting a commodity CPU heat sink over the FETs.
The current design of the board is available here.
I’ve tested a prototype of the current design, and it does work, but I didn’t stress it very hard.